| 摘要 |
<p>PURPOSE:To provide a composite lead frame, to be used for a semiconductor device, on which a bonding wire can be made short, the connected part of the bonding wire can be accurately recognized using a monitoring camera when a bonding work is conducted by a bonder, and the bonding can be connected accurately. CONSTITUTION:The title lead frame is provided with a signal wiring formed on one surface of an insulating layer 14, a power supply wiring layer 15 formed on other surface of the insulating layer 14, a wiring substrate 12 on which a semiconductor chip 13 is mounted on one surface side, and a lead frame main body 11 on which a lead part 11a, to be electrically connected to the wiring layers 15 and 16 of the wiring substrate 12. The power source wiring layer 15 is exposed to one surface of the wiring substrate 12, a recessed part 21 is made in one side of the substrate 12, and the semiconductor chip 13 is mounted on the above-mentioned recessed part.</p> |
