| 摘要 |
PURPOSE:To enable a semiconductor device equipped with a heat dissipating member to be thinned and enhanced in heat dissipating properties. CONSTITUTION:A semiconductor device is composed of a device main body 11 equipped with a package 14 which seals up a semiconductor element 13 and leads 15 that electrically connect the semiconductor element 13 with an external circuit and a heat dissipating plate 12 bonded to the surface of the package 14 through the intermediary of bonding agent 18, where a junction part 12b is provided to the surface of the heat dissipating plate 12 joined to the package 14, a heat dissipating part 12a is formed on the other surface of the plate 12, and the heat dissipating part 12a is set larger than the junction part 12b in area. |
