发明名称 PCB having metallic core in thermal contact with components - uses heat conduction from each component into metallic bolt in threaded bore through plate between component side and solder side
摘要 Each integrated circuit or other electronic component (14) is connected electrically by wire bonds (contacts) (14a) to the component side (11) of the board (10). Its underside (14b) rests in good thermal contact with the top (15a) of a metallic bolt (15) screwed into a bore (16) through the metallic plate (13). Heat is conducted away to an additional heat-sink (18) connected to the plate by thermally conductive spacers (19) through the solder side (12). Alternatively the heat-sink may be subdivided into parts each supported by one of the bolts. ADVANTAGE - Heat produced in the electronic components is dissipated easily, reliably and effectively esp. where the surface concn. of heating is high.
申请公布号 DE4218419(A1) 申请公布日期 1993.12.09
申请号 DE19924218419 申请日期 1992.06.04
申请人 PHILIPS PATENTVERWALTUNG GMBH, 20097 HAMBURG, DE 发明人 HELLER, MICHAEL, 8500 NUERNBERG, DE;PYTLIK, WOLFGANG, 8542 ROTH, DE;SCHUH, ALBRECHT, 8500 NUERNBERG, DE
分类号 H05K1/02;H05K7/20;(IPC1-7):H05K1/05 主分类号 H05K1/02
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