THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARD

摘要

A thermally conductive circuit carrying substrate (29) is made from a layer of metal (24), a reinforcing medium (12), thermally conductive particles (15), and a resin (16). The resin has the thermally conductive particles dispersed throughout. The reinforcing medium and the resin-particle mixture are formed into a sheet-like laminated structure (19). The layer of metal is laminated to at least one side of the laminated structure to form a printed circuit board. The reinforcing medium is typically chopped or woven glass fibers, or paper sheets such as ARAMID. Epoxy, cyanate ester, or polyimide resins are used, and aluminum nitride particles are dispersed throughout. A sheet of copper is used as the metal in order to define a circuit pattern on the printed circuit board. Each of the layers are stacked one atop the other and laminated by heat and pressure to form a solid laminar structure that has improved thermal conductivity compared to conventional laminate structures.