| 摘要 |
1,168,420. Semi-conductor devices. WESTINGHOUSE ELECTRIC CORP. 19 Aug., 1968 [27 Sept., 1967], No. 39483/68. Heading H1K. A semi-conductor device is adapted to be encapsulated directly in a body 140 of a resin such as an epoxy resin without cushioning material by etching the peripheral side walls 126, 128 of the semi-conductor element after the application of the metal electrodes 123, 124, so that they have a concave form, thus minimizing their susceptibility to stress from the resin. Leads 130, 134 make contact to the electrodes which may be of molybdenum, tungsten or tantalum. |
