| 摘要 |
PURPOSE:To accurately mount an electronic component by previously accurately providing main and auxiliary electrodes on a board of the component, and positioning the component while measuring electric numeric values between both the electrodes. CONSTITUTION:A second auxiliary electrode 11 is formed at an opposite side to a mirror 2 to the electrode 11 and a main electrode 4 between the electrode 4 and the mirror 2 formed on a semiconductor substrate 1, and solder for fixing a semiconductor laser 3 is previously vapor-deposited on the electrodes 4, 11. Resistance meters 12, 13 for measuring resistance values between the electrodes 4, 10 and 4, 11 are provided. When the laser 3 is sucked to be moved on the substrate 1 and the resistance values are measured by the meter 12, the resistance value is reduced due to the fact that, when the laser 3 is disposed on the electrode 10, the value becomes parallel sum of the both. Since the laser 3 can be moved by a nozzle 7, a position where the values of the meters 12, 13 are maximum is discovered, and mounted. Accordingly, since it is positioned at a position having a maximum value while measuring the resistance value on the accurate electrode formed by a semiconductor process, it can be accurately mounted. |
