| 摘要 |
PURPOSE:To surface-package an electronic circuit module on a mother board in relation to said module comprising a printed substrate mounting electronic parts to be packaged on a mother board. CONSTITUTION:Contact pads 24a, 24b are provided on the end parts of a printed-substrate 22. Next, a supporting part 25 is provided on the end parts wherein the contact pads 24a, 24b are provided. Finally, a module fixing hole 29 is made in the position matching with the supporting part 25 on a mother board 27 when the printed substrate 22 is packaged. |
