Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern

摘要

A semiconductor device comprising a square package body 10, a plurality of leads 11 which jut out from each of four sides of the package body, a bevelled or chamfered portion 16 which is formed in at least one corner of the package body, and leads 11a, 11b which jut out from the bevelled portion 16.