发明名称 |
Semiconductor device comprising a TAB tape. |
摘要 |
In a semi-conductor device in which a semi-conductor element (14) is mounted on inner leads (12) of a TAB tape (10) and is sealed with a sealing resin (4). Upper and lower heat radiator members (17, 18) are secured by the sealing resin on both sides of the semi-conductor element in a sandwiching manner, and at least one heat radiator member has a protruded portion (20) at a site that corresponds to a surface of the semi-conductor element in a manner to approach the surface of the semi-conductor element in order to prevent the semi-conductor element from tilting in the sealing resin. <IMAGE> |
申请公布号 |
EP0573297(A2) |
申请公布日期 |
1993.12.08 |
申请号 |
EP19930304324 |
申请日期 |
1993.06.03 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO. LTD. |
发明人 |
KURAISHI, FUMIO;WADA, NORIO;UCHIDA, HIROFUMI |
分类号 |
H01L21/56;H01L23/28;H01L23/29;H01L23/433;H01L23/495;H01L23/552 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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