| 摘要 |
PURPOSE:To improve the heat resistance of the positive type chemical amplification photoresist by incorporating a crosslinking agent therein. CONSTITUTION:The crosslinking agent is further added to the positive type chemical amplification photoresist of a binary system contg. a phenolic resin and a photoacid generating agent or a ternary system contg. further a dissolution suppressor in these components. The positive type chemical amplification photoresist 2 is brought into a crosslinking reaction by baking at the temp. higher than the temp. of post-exposing baking after pattern exposing, post- exposing baking, developing and full-surface exposing, by which the resin is polymerized to a higher polymer and the heat resistance of resist patterns 3 is thereby improved. |
