发明名称 |
Method for thinning a semiconductor wafer |
摘要 |
A method for thinning a semiconductor wafer (11) is provided. An support film (15) is mounted to the semiconductor wafer (11). The support film (15) provides support for a semiconductor wafer during thinning as well as protection for a front-side (12) of the semiconductor wafer (11). After mounting the support film (15) to the semiconductor wafer (11), a back-side (13) of the semiconductor wafer is etched in a two step process. First the back-side (13) undergoes a mechanical grinding followed by a chemical etch. A metal film (18) may be sputtered on the back-side (13). The semiconductor wafer (11) having the support film (15) is placed in a tape frame (20) for dicing operations and the support film (15) is removed from the front-side (12) of the semiconductor wafer (11).
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申请公布号 |
US5268065(A) |
申请公布日期 |
1993.12.07 |
申请号 |
US19920993984 |
申请日期 |
1992.12.21 |
申请人 |
MOTOROLA, INC. |
发明人 |
GRUPEN-SHEMANSKY, MELISSA E. |
分类号 |
H01L21/02;H01L21/302;H01L21/304;H01L21/306;H01L21/68;H01L21/78;(IPC1-7):H01L21/306;B44C1/22 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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