发明名称 |
Printed wiring board |
摘要 |
A printed wiring board has a substrate having an outer peripheral edge. A printed circuit is formed on at least one side of the substrate. A shock-absorbing band formed of copper foil is disposed along at least a portion of the outer peripheral edge of at least one side of the substrate and is effective to absorb at least some of the impact applied to the printed wiring board during cutting thereof.
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申请公布号 |
US5268535(A) |
申请公布日期 |
1993.12.07 |
申请号 |
US19910739707 |
申请日期 |
1991.08.02 |
申请人 |
NIPPON CMK CORP. |
发明人 |
KAWAKAMI, SHIN;HARUYAMA, SATOSHI;OKONOGI, HIROTAKA |
分类号 |
H05K1/02;H05K3/00;(IPC1-7):H05K1/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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