| 摘要 |
PURPOSE:To precisely and accurately judge the quality of the mounted state of a component. CONSTITUTION:The whole face of a conveyed printed circuit board 11 is two- dimensionally scanned with a laser beam 16, and the position signal S23 outputted from a position detecting element 22 is converted into the height and intensity data of a component 12 by an image arithmetic process section 24. The maximum average value of the intensity of the component 12 is found by a lead position decision section 27 based on the measured intensity data to decide the position of a lead, and the minimum average value of the intensity is found by a lead tip position decision section 30 to decide the tip position of the lead. The intensity data, the intensity data average value in the same group, and the correlation coefficient with the good and defective sample data from a sample data memory section 33 are calculated by a judging process section 34, they are compared with the judging threshold values from a judging threshold value memory section 32, and the bridge between leads is judged. |
