| 摘要 |
PURPOSE:To realize the approaching of a probe to adjusting pads on an IC in the shortest course, to improve the working efficiency of output adjustment such as zero-point adjustment and the shortening of time and to facilitate the design of a probe device when the output of an hybrid IC is adjusted CONSTITUTION:Pad groups 21 and 22 for adjusting sensitivities and zero points, which can be brought into electrical contact with external-signal applying probes, are arranged on the surface of an IC chip 10 in one line or a plurality of lines. On a substrate 19, external elements 18a-18c, which are higher than wire bondings 30 hooked along the IC chip and the external part of the chip and the pads 21 and 22, are arranged at the arranging positions of the output adjusting pads 21 and 22 and the outside of a region B between the extending line A of the alignment and one side A' of the substrate 19. |
