| 摘要 |
<p>PURPOSE:To provide an exposure mask and the manufacture of a semiconductor device using it which make it feasible to make an accurate alignment with the orientation flat of a wafer accurately. CONSTITUTION:An alignment mark 4 for making the alignment of an orientation flat 11 with a pattern 3 is provided in the mask blank 2 of an exposure mask 1. A linear pattern and a dot pattern are formed as the alignment mark 4, and scale patterns 41a, 41b are provided at regular intervals between a plurality of alignment marks 4. Also, this is the manufacture of a semiconductor device, in the exposure process of which the alignment of the alignment mark 4 of the exposure mask 1 with the orientation flat 11 of the wafer 10 is performed.</p> |
