Photo-setting resist composition, a process for producing a printed circuit board by using the composition, and a printed circuit board obtained by using the composition

摘要

A printed circuit board has a resist layer made from a photo-setting resist composition containing: (A) a polyfunctional unsaturated compound which is solid at room temperature, (B) a polyfunctional unsaturated compound which is liquid at room temperature, (C) a photopolymerization initiator, (D) an epoxy resin, (E) at least one member selected from the group consisting of: (i) a curing agent for the epoxy resin and either melamine or the derivative thereof, and (ii) a compound having a 2,4-diamino-s-triazine ring and an imidazole ring in the molecule.