Method of manufacturing long and narrow electronic part

摘要

A pair of holes are formed with a predetermined space therebetween on a long and narrow base plate. An adhesive is applied to the surface of the base plate. Head substrates each having a row of thermal resistors on the surface thereof are placed on the adhesive on the base plate such that the joint of the head substrates is positioned between the pair of holes of the base plate. The adhesive is hardened in the state in which the head substrates are pushed upward by thrusting means inserted into a pair of holes while the base plate is supported from below and the head substrates is pressed from above. The base plate is bonded to a radiating plate by an adhesive only at the central portion. Thus, there is no difference in level at the joint of the head substrates, and even when the radiating plate expands due to heat, the base plate is not deformed.