发明名称 |
PACKAGE FOR ELECTRONIC PARTS |
摘要 |
PURPOSE:To obtain a package for electronic parts, which can reliably prevent a brazing material flowing out from the part where the package is brazed from flowing into the welding part where hard glass of the package is welded. CONSTITUTION:In a package for electronic parts, a barrier layer 70 difficult to wet with a brazing material is formed on the end surface of a cylinder body 24 which is the surface on the package member between an outer surface of the cylinder body 24 which is the part where a package is brazed and a stepped surface 26 of the inner periphery inside of the cylinder body which is the welding part where hard glass is welded. |
申请公布号 |
JPH05319471(A) |
申请公布日期 |
1993.12.03 |
申请号 |
JP19920149921 |
申请日期 |
1992.05.18 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
HIGUCHI TSUTOMU |
分类号 |
B65D85/00;B65D85/38;B65D85/86;H01L23/02;H01L33/00 |
主分类号 |
B65D85/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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