发明名称 PACKAGE FOR ELECTRONIC PARTS
摘要 PURPOSE:To obtain a package for electronic parts, which can reliably prevent a brazing material flowing out from the part where the package is brazed from flowing into the welding part where hard glass of the package is welded. CONSTITUTION:In a package for electronic parts, a barrier layer 70 difficult to wet with a brazing material is formed on the end surface of a cylinder body 24 which is the surface on the package member between an outer surface of the cylinder body 24 which is the part where a package is brazed and a stepped surface 26 of the inner periphery inside of the cylinder body which is the welding part where hard glass is welded.
申请公布号 JPH05319471(A) 申请公布日期 1993.12.03
申请号 JP19920149921 申请日期 1992.05.18
申请人 SHINKO ELECTRIC IND CO LTD 发明人 HIGUCHI TSUTOMU
分类号 B65D85/00;B65D85/38;B65D85/86;H01L23/02;H01L33/00 主分类号 B65D85/00
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