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发明名称
SEMICONDUCTOR DEVICE FEED MECHANISM BETWEEN LEAD CUTTING DIE AND LEAD MOLDING DIE
摘要
申请公布号
JPH05319546(A)
申请公布日期
1993.12.03
申请号
JP19920124796
申请日期
1992.05.18
申请人
NEC YAMAGATA LTD
发明人
KIKUCHI HISAKAZU
分类号
B65G47/14;H01L23/50;(IPC1-7):B65G47/14
主分类号
B65G47/14
代理机构
代理人
主权项
地址
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