APPARATUS FOR MOLDING RESIN SEALING PART OF ELECTRONIC PART

摘要

PURPOSE:To certainly and efficiently confirm such a state tha the wire of the diode mounted on a lower mold runs off the wire fitting groove of the lower mold. CONSTITUTION:A horizontal press plate 76 going in and out with respect to the upper position of a lower mold 42 and moving up and down is provided and a magnetic non-contact type sensor 79 is provided to the lower mold 42. The press palte 76 is allowed to fall to be pressed to the wire 2 of the diode 1 on the lower mold 42. In this state, the height from the parting line surface 42a of the lower mold 42 to the under surface of the press plate 76 is detected by the sensor 79. The diameter of the wire 2 is 0.5mm but, when the height is 0.3mm or less, molding operation is continued because of normality and, when the height is 0.3mm or more, molding operation is stopped because of abnormality. The wire 2 ready to slightly come off is pushed in a wire fitting groove 58 by the press plate 76.