Socket for IC package.

摘要

A socket for an IC package including a plurality of contacts arranged in array in such a manner as to correspond to a plurality of IC leads of an IC package, each of the contacts comprising a first unitary contact extending to a lower surface portion of each of the unitary IC leads so as to be brought into pressure contact with the lower surface portion, and a second unitary contact extending to a side surface portion of the lead so as to be brought into pressure contact with the side surface portion, the first and second unitary contacts having male terminals separately connected to a wiring board, respectively.