| 摘要 |
The invention relates to a mounting system for highly integrated components which are mounted on printed-circuit boards and have more than 500 pins and a power loss of more than 50 watts. The component (1) is in this case arranged on a ceramic platelet (2) which has a spider (3) on the side facing the component (1). This spider (3) matches the fine lead spacing of the component (1) to the coarser spacing of the printed-circuit board connections. Both the component connections and the printed-circuit board connections are connected to the spider (3) on the ceramic plate (2). Both the top and the bottom of the component (1) are placed directly onto heat sinks. A small ceramic frame (11) is arranged around the contact zone of the component (1) with the spider (3) on the ceramic platelet (2), over which small ceramic frame (11) a membrane (4) is tensioned, the cavity which is produced thereby being filled with an inert cooling fluid. In consequence, all sides of the surface of the component are cooled and optimum heat dissipation is achieved. <IMAGE> |
