| 摘要 |
This invention relates to a composition comprising: water; particulate abrasive dispersed in said water, said abrasive having a Knoop scale hardness of at least about 1000 and an average particle size of from about 1 micron up to a U.S. Sieve Series Number of about 50; and an effective amount of at least one thickener to maintain a stable dispersion of said abrasive in said water. The inventive composition can contain one or more surfactants and/or one or more chelating agents. In one embodiment the invention provides for a water-based polish that can be used on any nonporous surface (e.g., glass, plastic, metal, painted surfaces, waxed surfaces, marble, ceramic, soft-precious and semi-precious stones, semi-conductor materials, metallurgical and geological specimens, Formica, etc.). In a particularly advantageous embodiment the electrical conductivity of the inventive water-based polish is sufficiently reduced to the point where it can be applied using an electrically powered applicator without risk of injury to the user due to electrical shock.
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