发明名称 |
Printed wiring board having through-holes covered with ink layer and method of manufacture thereof |
摘要 |
A printed wiring board includes a substrate having an electrically conductive pattern disposed on at least one side of the substrate. An electrically conductive through-hole is formed in the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are disposed over the conductive pattern but do not cover the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. A method of manufacturing the printed wiring board embodied by the invention comprises providing a substrate having an electrically conductive through-hole. A conductive pattern is formed on at least one side of the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are formed over the conductive pattern but not over the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. The ink layer may be formed simultaneously with the printing of symbols of electronic parts to be mounted on the printed wiring board.
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申请公布号 |
US5266748(A) |
申请公布日期 |
1993.11.30 |
申请号 |
US19910670320 |
申请日期 |
1991.03.15 |
申请人 |
NIPPON CMK CORP. |
发明人 |
KAWAKAMI, SHIN;OKONOGI, HIROTAKA;NIKAIDO, KATSUTOMO;ICHIKAWA, JUNICHI;NISHIYAMA, YOSHIO |
分类号 |
H05K3/28;H05K1/02;H05K3/00;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H05K1/00 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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