发明名称 Method for placing modules on a carrier
摘要 PCT No. PCT/DE89/00688 Sec. 371 Date Apr. 29, 1991 Sec. 102(e) Date Apr. 29, 1991 PCT Filed Oct. 26, 1989 PCT Pub. No. WO90/05344 PCT Pub. Date May 17, 1990.Method for placing modules on a carrier. Modules, for example cells, are placed on a carrier, for example a chip, with the method. For placement, the modules are arranged such on the placement region of the carrier that the center of gravity of the modules falls onto the center coordinates of the placement region (global placement S1). Subsequently, the placement region is partitioned into sub-regions, modules are allocated to the sub-regions and the area of the sub-regions is defined in the ratio of the area of the modules allocated to these sub-regions (partitioning, S2). In the next step, a global placement is again carried out, i.e. the modules are arranged such in the sub-regions that the modules allocated to the sub-regions have their center of gravity falling onto the center coordinates of these sub-regions. The steps of global placement and of partitioning follow one another until only at most k modules are still present per sub-region. The ultimate position of the modules is then implemented with the assistance of an optimization step (S3), wherein the position for the modules whereat the area exploitation is optimum is calculated taking the position of the modules achieved in the global placement into consideration.
申请公布号 US5267176(A) 申请公布日期 1993.11.30
申请号 US19910684902 申请日期 1991.04.29
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 ANTREICH, KURT;JOHANNES, FRANK;KLEINHANS, JURGEN;SIGL, GEORG
分类号 H01L21/822;G06F17/50;H01L21/82;H01L27/04;(IPC1-7):G06F15/60 主分类号 H01L21/822
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