| 摘要 |
The surface of a solder portion is specular. Besides, it includes a flat plane, a steep inclined plane and a gentle inclined plane. Accordingly, when light is projected toward the solder portion in a specified direction and light reflected from the solder portion is observed with a camera, an image having the contrast between brightness and darkness is obtained. The present invention utilizes such light reflection characteristics of the solder portion in order to judge whether the shape of the solder portion is good or bad. According to the present invention, light is projected toward a solder portion for bonding the electrode of an electrical component to a substrate, in directions of at least two angles, and the solder portion is observed by a camera disposed above this solder portion. Subsequently, image data items picked up at the respective angles by the camera are stored in corresponding image memories, and the image data items are processed in combination by an image processor. Subsequently, image data having the feature of the shape of the solder portion as generated by the processing is stored in an image memory, and the quality of the shape of the solder portion is judged on the basis of the generated image data by a CPU.
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