| 摘要 |
<p>A modified high density backplane (MHDB) connector is provided for electrically interconnecting high density printed circuit boards having predetermined interconnect circuitry including high density arrays of ground/signal contact pads, discrete power pads and discrete ground pads. The MHDB connector includes one or more contact modules, a connector housing, a pcb biasing mechanism,, connector end caps, a flexible film, two interactive biasing modules for each contact module, and a camming member secured to the pcb to be mated. The MHDB connector may also include one or more power contact modules and one or more mounting blocks as intermediate spacing/securing elements and/or end-positioned securing elements. The contact module holds the arrays of interconnect contact rivets, provides connector to pcb alignment and provides the capability to readily reconfigure the MHDB connector for different applications. The interactive biasing modules coact with the flexible film to provide uniform contact force distribution over the interconnect regions of the connector and provide contact rivet displacement tolerance relief. The MHDB connector provides sequenced movement of the pcb to be mated into the contact rivets to provide contact wipe and may provide for alignment of the one pcb with the MHDB connector. The end caps provide for MHDB connector sealing and localized securement of the connector to the pcb. The power contact modules may include supply and return contacts and provide the capability for reconfiguring the MHDB connector for diverse applications.</p> |
