发明名称 Electronic cooling card utilising thermal conduction for printed circuit - has rigid heat-sink fitted and fixed to card with thermic surface contacting components of printed circuit
摘要 The cooling electronic card has a heat-sink (1) which covers a printed circuit (2) having electronic components (3). The face (4) of the heat-sink fits exactly the shape (5) of the printed circuit and its components and fits exactly over them. The two faces (4, 5) are separated by an empty space (6) of a few tenths of a millimetre corresponding to the thickness of film. The space is used to assure a thermal coupling between the sink and the printed circuit and to assure a mechanical coupling between the sink and the printed circuit. The thermal and mechanical coupling is achieved using an electric insulator (7) which is a good thermal conductor and an adhesive such as a mastic, a resin or a grease inserted between the face of the heat-sink and the face of the printed circuit equipped with the components, which combined with the space assure thermal coupling without heat accumulation points. USE - Electronic heat-sink for printed circuits in form of covering card. For civil or military applications.
申请公布号 FR2691604(A1) 申请公布日期 1993.11.26
申请号 FR19920006041 申请日期 1992.05.19
申请人 THOMSON CSF 发明人 SUPPA VITO
分类号 H05K3/28;H05K7/20;(IPC1-7):H05K7/20;H05K3/30 主分类号 H05K3/28
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