| 摘要 |
PURPOSE:To provide a connector for an integrated circuit, where a small-sized high frequency HIC can be mounted on a circuit board in high density. CONSTITUTION:A plurality of terminal openings 13 are formed along the inner surface of a frame-like member 12 of a case-like housing 20 having a bottom plate 11 and the frame-like member 12. An SMT type terminal 30 is press-fitted into the terminal opening 13. One or more HICs 50 are superposingly mounted inside the case-like housing 20, to be connected to a solder connection portion 32 of the terminal 30 by reflow soldering. The top of the case-like housing 20 is covered with a shield cover 60, as required. |
