FLEXIBLE PRINTED-SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND COMPOUND LEAD FRAME FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide the title flexible printed-substrate for mounting semiconductor element and compound lead frame for semiconductor device capable of enhancing the transmission characteristics of semiconductor device while facilitating the manufacture thereof having excellent mass-productivity. CONSTITUTION:An aperture part coping with the arrangement of a semiconductor element 26 and a tape carrier 15 for TAB is formed in the central part of a both surface wired flexible printed-substrate whereon a signal wiring layer 14 and a ground layer 20 are respectively formed on the surface side and rear surface side while a part of the ground layer 20 is extended in the aperture part so as to form a semiconductor element mounting part serving both as a heat dissipating part 22.