首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SOLDER PLATING DEVICE FOR SEMICONDUCTOR ELEMENT LEAD FRAME
摘要
申请公布号
JPH05315505(A)
申请公布日期
1993.11.26
申请号
JP19920146603
申请日期
1992.05.12
申请人
EBARA CORP;IWATE TOSHIBA ELECTRON KK;TOSHIBA CORP
发明人
HONGO AKIHISA;ISHIKAWA SEIJI;HOSHINO MASAHIRO;SUGAWARA ATSUSHI;MATSUDA YOSHIHIRO
分类号
C23C2/08;H01G13/00;H01L23/50;(IPC1-7):H01L23/50
主分类号
C23C2/08
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Blade for wind turbine generator and method for assembling said blade
DENTAL FORMULATION
Automated demand response energy management system
Barbecue grill with multiple burner outputs
Systems and methods for generating germicidal compositions
Purine derivatives for the treatment of viral infections
Supercritical hydrolysis of biomass
Preparations containing amorphous emodepside
Milk and a process for its preparation
Quartet breeding
Conditionally active anti-epidermal growth factor receptor antibodies and methods of use thereof
A therapeutic preparation for the treatment of mastitis and preparation process thereof
USE OF IBOGAMINE CONGENERS FOR TREATING OBESITY
MEDICAL VALVE ASSEMBLY
PANNEAU D’ATTENUATION ACOUSTIQUE EN MATERIAU COMPOSITE A MATRICE CERAMIQUE ET A AME METALLIQUE
ELECTRODE POUR BATTERIE DE VEHICULE
PROCEDE POUR MODIFIER L'ASPECT D'UNE STRUCTURE A EFFET INTERFERENTIEL COLORE
POULIE ET DISPOSITIF A POULIE COMPRENANT UNE TELLE POULIE
DISPOSITIF D'ELEVAGE DE BIVALVES
PROCEDE DE POST-TRAITEMENT D'OBJETS TRIDIMENSIONNELS FABRIQUES PAR STEREOLITHOGRAPHIE