| 摘要 |
PURPOSE:To provide a method for manufacturing a multilayer printed circuit board which can connect connecting lands without employing a through hole plating method. CONSTITUTION:The method for manufacturing a multilayer printed circuit board comprises the steps of forming the board 15 by laminating inner and outer layer printed circuit boards 1, 4, 6 while aligning them, and charging leads 25 of a plurality of small-gage wires 16 of an electronic component 23 in through holes 12, 13, 14 of connecting lands 8, 9, 10, 11 of printed wiring circuits 2, 3, 5, 7 of the boards 1, 4, 6 to mount the component 23. The methods further comprises the steps of filling melted solders 16 in the holes 12, 13, 14 by utilizing capillarity of the leads 25 of the component 23, and solidifying the solders to electrically connect the circuits 2, 3, 5, 7, thereby manufacturing a multilayer printed wiring circuit 15 in which the circuits 2, 3, 5, 7 from the first to fourth layers are formed as inner layers. |
