| 摘要 |
<p>PURPOSE:To perform mounting of the parts on both sides of a printed circuit board without changing a jig by finishing mounting of the parts on one side surface followed by inverting the board mother material in order to perform mounting of the parts on the other side surface. CONSTITUTION:In the case of performing mounting and soldering of the electronic parts on a board mother paterial 1, the board mother material 1 is set for instance, with the surfaces 2A, 3A of the printed circuit boards 2, 3 up while, for instance, being moved in the arrow direction so as to by turns perform automatic mounting and soldering of the electronic parts on the upper surface of the board mother material 1 in order to stock a required quantity thereof. Later, the board mother material 1 is laterally inverted around a symmetrical line A-A for being again set on an automatic assembler so that the surfaces 4A and 5A of the printed wiring boards 4, 5 may be up similarly to perform mounting of the electronic parts on the other side surface of the board mother material 1. Thereby, mounting or the like of the electronic parts can be performed on both sides of the board material 1.</p> |
