| 摘要 |
<p>PURPOSE:To prevent black mark generation due to cutting scrap in the assembling process of a solid-state imaging device, in particular, at the time of dicing, and improve the peeling rate of a surface protecting sheet. CONSTITUTION:A surface protecting sheet 5 is stuck on the surface of a wafer on which a solid-state imaging device is formed, and the wafer is stuck on a sheet 2 for dicing. After dicing, the sheet 2 for dicing is expanded, and the intervals ((a) and (b)) between cut-off chips 4 are ensured as specified values (e.g. 5mm or longer). After that, the surface protecting sheet 5 is exfoliated by using a sheet 3 for peeling.</p> |
