| 摘要 |
PURPOSE:To improve mounting efficiency and to excellently transfer a signal between circuit substrates in a semiconductor device having a single-in-line package structure. CONSTITUTION:In a semiconductor device which is mounted on a circuit substrate in an uprightly erected state, connection leads 14 are bent in the vicinity of a resin package 11, supporting leads 12a, 12b, 13a and 13b are extended in different directions, the resin package 11 is supported by the extended supporting leads 12a, 12b, 13a ands 13b, and the resin package is placed on the circuit substrate in a vertically erected state. |
