| 摘要 |
<p>PURPOSE:To narrow an interval between Cu conductors by combining a screen printing method with a photolithographic technique. CONSTITUTION:After a ceramic green sheet is manufactured, it is cut, and through holes are further formed. Ag paste for charging the holes and Ag paste for inner wirings are screen printed, and the sheets are laminated and integrated. This laminate is baked to obtain a low temperature-baked ceramic multilayer circuit board 1. Thick film Cu paste is screen printed on the baked board 1, dried and then baked at 600 deg.C in a nitrogen atmosphere. Then, a photoresist dry film is laminated, and pattern-exposed through a photomask. Further, the resist is developed, dried at the ambient temperature, and then the exposed thick film Cu conductor is etched. Eventually, unnecessary photoresist is removed, and a predetermined thick film Cu conductor pattern 4 is formed on the board 1.</p> |
