发明名称 MANUFACTURE OF MULTILAYER COPPER-CLAD LAMINATE
摘要 <p>PURPOSE:To prevent wrinkles from being generated on a surface to make yield and workability satisfactory by putting a mirror plate, in which electrolytic copper is deposited to a certain thickness, upon prepreg so that the deposition surface of electrolytic copper comes into contact with the prepreg and by heating, pressurizing and forming the whole into an integral body so that the electrolytic copper on the mirror plate is transferred onto the prepreg and an external layer copper foil is formed. CONSTITUTION:A circuit pattern 4b is formed on a glass epoxy both-side copper-clad laminate as base material 4a so that an internal layer plate 4 is made. Glass epoxy prepregs 3 are put upon both sides of this internal layer plate 4, a mirror plate l, in which electrolytic copper 2 is previously deposited as external copper foil and surface treatment is performed, is used to hold the glass epoxy prepregs 3 between from above and below, and the whole is heated, pressurized and formed into an integral body so that the electrolytic copper 2 on the mirror plate 1 is transferred onto the glass epoxy prepregs 3 and a multilayer copper-clad laminate is manufactured. According to the manufacture of the multilayer copper-clad laminate, wrinkles generated on the surface of the multilayer copper-clad laminate are prevented and the multilayer copper-clad laminate being satisfactory in yield and workability is obtained.</p>
申请公布号 JPH05315749(A) 申请公布日期 1993.11.26
申请号 JP19920146303 申请日期 1992.05.13
申请人 TOSHIBA CHEM CORP 发明人 SATO NORIYUKI;YASUDA MAKOTO
分类号 B32B37/00;B29K105/06;B32B15/08;H05K3/46;(IPC1-7):H05K3/46;B29D9/00 主分类号 B32B37/00
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