| 摘要 |
<p>PURPOSE:To reduce recesses generated in the lead-through hole part of through- hole plating at the time of superposing printed wiring boards having through- hole plating at least on one face or on both faces and heating, pressurizing and laminating the whole into an integral body. CONSTITUTION:In the manufacture of a laminated printed wiring board in which printed wiring boards having through-hole plating are superposed at least on one face or on both faces and the whole is heated, pressurized and laminated into an integral body, laminated structure caul plates 18a each having a rubber elastic body layer are put on the surfaces of time printed wiring boards 13a, 13b having through-hole plating to be superposed on one face or both faces so that the rubber elastic body sides and the surfaces of the wiring boards are joined together, and the laminated structure caul plates are removed after the whole is heated and pressurized from above and below and laminated into an integral body.</p> |
