| 摘要 |
<p>PURPOSE:To provide an electronic component having a high reliability in heat radiatiang characteristics, electric connection and functional property and also having a high yield of production in a mounting process. CONSTITUTION:The title sealed type electronic part is provided with a multilayer interconnection board 1 having an aluminum nitride substrate 1a, an electronic part 2 which is mounted on one main surface of the multilayer interconnection board and electrically wire-bonded (4) to the lead pattern 3 provided on one main surface of the multilayer interconnection board 1, a lead terminal 5 which is led out to other main surface of the multilayer interconnection board 1 as an input-output terminal to the electronic component 2, and an aluminum nitride sealed body 6 which is mounted and arranged on one main surface side of the mulilayer interconnection board 1 for sealing of the electronic component 2 and the lead pattern 3. A brazing filler material stopping part 7 is provided in the vicinity of the part where the lead terminal 5 is led out from the multilayer interconnection board 1, or the lead terminal 5 is randomly led out from the multilayer interconnection board 1.</p> |
