| 摘要 |
PURPOSE:To mount an IC chip having large power consumption by a method wherein the thermal resistance of a semiconductor device is decreased utilizing the lead-out conductor of the semiconductor device and the pad of the IC chip. CONSTITUTION:A bump 17, which is composed of the substance having the property that its coefficient of thermal conductivity is larger than the protective resin of an IC chip 1, is formed on an independent pad 4 formed on the IC chip 1. The bump 17 and the outer conductor 13, on an outer substrate 12, are connected to a flip chip. The quantity of heat generated in the IC chip is conducted to the protective resin of the bump 17 and the IC chip 1, the quantity of heat is conducted to the outer conductor 13 from the bump 17. As the coefficient of thermal conductivity of the bump 17 is larger than that of the protective resin of the IC chip 1, the quantity of heat generated in the IC chip 1 is conducted to the contact surface between the bump 17 and the outer conductor 13 by connecting the independent part 4 on the IC chip and the outer conductor 13 to the bump 17, and thermal resistivity is decreased because the quantity of heat is increased. |
