发明名称 MANUFACTURE OF PREFORM FOR DIE BONDING
摘要 PURPOSE:To provide a manufacture capable of forming a preform with a desired thickness (that is, desired volume) and a precise shape. CONSTITUTION:A mask 12 in which an opening with desired shape and size is formed is placed on a film 11 serving as a base. In this condition, a thin film layer 13 of a preform material with a desired thickness is formed on the film 11 and then the thin film layer 13 is removed from the film 11. By this, a manufacture of forming a preform for die bonding is provided so as to form the preform with the desired shape, size and thickness.
申请公布号 JPH05315375(A) 申请公布日期 1993.11.26
申请号 JP19910140937 申请日期 1991.05.16
申请人 MITSUMI ELECTRIC CO LTD 发明人 ONO TADASHI;WATANABE SHIGEMITSU;KASAHARA MASAKI;SAKAGUCHI SHINICHI
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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