发明名称 THIN FILM METALLIZATION AND BRAZING OF ALUMINUM NITRIDE
摘要 The aluminum nitride metallized structure (10) of the present invention includes a substrate (11) comprising an AlN sintered body and a metallized structure (21) formed on the substrate comprising a first layer (12) deposited on the sintered body and a second (B) layer deposited on the first layer (12). The first layer (12) comprises an alloy having the general formula (a) based on atomic percent: XxZ100-x wherein X is at least one member selected from the group consisting of Ti, Zr, Hf and the rare earth elements, Z is at least one member selected from the group consisting of Mo, W, Cr, Nb, V and Ta, and 10 < x < 60 atomic %. The second layer (13) comprises at least one member selected from the group consisting of Au, Co, Cu, Ni, and Fe.
申请公布号 WO9323246(A1) 申请公布日期 1993.11.25
申请号 WO1993US04541 申请日期 1993.05.12
申请人 THE CARBORUNDUM COMPANY 发明人 TENHOVER, MICHAEL, A.;ADLAM, EDWIN, J.
分类号 H05K1/09;B23K35/30;B32B15/04;B32B18/00;C04B37/02;C04B41/52;C04B41/89;H05K1/03;H05K3/38;(IPC1-7):B32B9/00;B23K31/02 主分类号 H05K1/09
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