INTEGRATED-CIRCUIT PACKAGE CONFIGURATION FOR PACKAGING AN INTEGRATED-CIRCUIT DIE AND METHOD OF PACKAGING AN INTEGRATED-CIRCUIT DIE

摘要

A package design configuration for an integrated-circuit die (104) includes a leadframe having its bonding fingers (106) connected to the periphery of an electrically-insulated, heat-conductive substrate (102), formed, for example, of a ceramic material. A number of electrically conductive traces (110), or bonding islands, serve as intermediate bonding locations for shorter bonding wires (112, 116) connecting bonding pads (114) on the integrated-circuit die (104) to the bonding fingers (106) of the leadframe. The integrated-circuit die overlies the conductive traces while still providing an exposed portion of the conductive traces as a respective intermediate attachment area for respective bonding wires. The conductive traces serving as bonding islands are formed by deposition of thin-film material using semiconductor fabrication techniques or by deposition of thick-film material using printing techniques.