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发明名称
Verfahren zum Verpacken, von Halbleiterbauelementen und verpackter Artikel.
摘要
申请公布号
DE3787843(D1)
申请公布日期
1993.11.25
申请号
DE19873787843
申请日期
1987.07.23
申请人
MOTOROLA, INC., SCHAUMBURG, ILL., US
发明人
DUNCAN, WILLIAM, GLASGOW G72 9NP, GB
分类号
H05K13/00;(IPC1-7):H05K13/00
主分类号
H05K13/00
代理机构
代理人
主权项
地址
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