| 发明名称 |
MULTILAYER INTERCONNECTS |
| 摘要 |
<p>A multilayer interconnect comprising a ceramic substrate, a patterned conductor layer, a layer of acrylic or acrylate adhesive, an organic insulating film, and a metal foil layer. Active electrical components can be soldered onto the metal foil layer. These circuits are particularly useful in under the hood automotive applications.</p> |
| 申请公布号 |
KR930011159(B1) |
申请公布日期 |
1993.11.24 |
| 申请号 |
KR19900011699 |
申请日期 |
1990.07.31 |
| 申请人 |
E.I. DU PONT DE NEMOURS & CO. |
发明人 |
PATTERSON, FRANK K.;KILLIAN, CARL E. |
| 分类号 |
B32B15/08;C09J133/02;C09J133/04;C09J133/08;C09J133/20;H05K1/03;H05K1/09;H05K3/38;H05K3/46;(IPC1-7):C09J133/08 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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