Photosensitive resin composition having high resistance to oxygen plasma, containing alkali-soluble organosilicon polymer and photosensitive dissolution inhibitor

摘要

Disclosed herein is a photosensitive resin composition composed mainly of an alkali-soluble organometallic polymer and a photosensitive dissolution inhibitor. The composition is used as a positive type resist which can be developed with an alkali developing solution. The resist has high sensitivity, high resolution, and resistance to oxygen plasma.