Method of manufacturing a multi-layered wiring board,申请号US19910801400-传众专利搜索

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发明名称	Method of manufacturing a multi-layered wiring board
摘要
申请公布号	US5264049(A)	申请公布日期	1993.11.23
申请号	US19910801400	申请日期	1991.12.02
申请人	TOPPAN PRINTING CO., LTD.	发明人	YOSHIDA, RISABURO;MURAKI, AKIRA;SAKUMA, YASUHIRO;ITOH, MASAHIRO
分类号	H05K3/38;H05K3/46;(IPC1-7):B32B31/00	主分类号	H05K3/38
代理机构		代理人
主权项
地址

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