| 摘要 |
PURPOSE:To obtain a device which can accurately inspect bonding wires for their loop shapes at a high speed. CONSTITUTION:This device is provided with a focal surface position controller 6 which moves the focal surface on which the image of a bonding wire is picked up, image pickup devices 5 and 5a which pick up images of the focal surface, picture input circuit 10 which converts the picked-up pictures into digital signals, and picture memory 11 which stores signals outputted from the circuit 10. In addition, the device is also provided with a wire signal readout circuit 12 which processes the video signal of the bonding wire after reading out the signal from the memory 11, wire signal memory 13 which stores wire signals outputted from the circuit 12, wire signal difference circuit 14 which reads out the wire signals of adjacent focal surfaces from the memory 13 and produces the difference between the signals, and zero difference position detection circuit 15 which calculates the focal surface position on which the difference becomes zero. |
