发明名称 PACKAGE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To simplify a supplying mechanism by combining a mount, a lead frame, a stem base and a cap, and resin-sealing a rear surface of the stem base. CONSTITUTION:A laser pellet 7 and a photodiode pellet 8 are respectively mounted on mounts 2, 4, bonded to wires 9 via leads 3, 5, and a lead frame having the leads 3, 5 is inserted into a stem base 10 aligned in a ribbon state to be welded. Then, caps aligned in a ribbon state are sealed in the welded base 10. Thereafter, a rear surface of the base 10 is resin-sealed by molding to complete assembled products aligned in a ribbon state. Thus, when an assembling step is automated, product supplying mechanisms becomes one frame from individual ones, thereby simplifying the mechanisms.
申请公布号 JPH05308157(A) 申请公布日期 1993.11.19
申请号 JP19920040002 申请日期 1992.02.27
申请人 NEC KAGOSHIMA LTD 发明人 MOTOJIMA HIDETO
分类号 H01L33/62 主分类号 H01L33/62
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