| 摘要 |
<p>PURPOSE:To improve humidity-resistance strength by preventing release of a chip due to stress on solder packaging. CONSTITUTION:Recessed and projecting parts 3 are provided on the front and rear surfaces of a chip 1 and the chip 1 is mounted on an island 5 of a lead frame through a mount material 4 such as Ag paste, thus improving adhesion property between the chip 1 and the mount 4. The adhesion property between the chip 1 and the mount material 4 is improved, thus preventing release of the chip 1 from occurring easily due to thermal stress on solder packaging.</p> |
